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Wire Bonder Product List and Ranking from 7 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Wire Bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. ヘッセ･メカトロニクス･ジャパン Tokyo//Industrial Machinery
  2. null/null
  3. カイジョー ODM事業部 Tokyo//Industrial Electrical Equipment
  4. 4 超音波工業 Tokyo//Industrial Electrical Equipment
  5. 5 兼松ＰＷＳ Kanagawa//Industrial Machinery
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Wire Bonder Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Wafer-level bonders enabling alternative processes for Cu pillars.
  2. Manual and Automatic Bonding Device 'BJ653' ヘッセ･メカトロニクス･ジャパン
  3. Ultrasonic Wire Bonder REBO-9 超音波工業
  4. 4 Semiconductor assembly equipment Wire Bonder FB-900 カイジョー ODM事業部
  5. 4 Semiconductor assembly equipment Wire Bonder FB-780 カイジョー ODM事業部

Wire Bonder Product List

1～17 item / All 17 items

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a significant track record of deliveries to government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel
  • Wire Bonder

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Semiconductor assembly equipment Wire Bonder FB-900

Semiconductor assembly equipment Wire Bonder FB-900

Further evolved, speed and stability.

This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.

  • Other semiconductor manufacturing equipment
  • Wire Bonder

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Ultrasonic Wire Bonder REBO-9

Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors
  • Wire Bonder

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High-speed fully automatic fine wire bonder 'BJ855'

High-speed fully automatic fine wire bonder 'BJ855'

Expansion of productivity! The large work area allows for batch processing of multiple devices.

The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment
  • Wire Bonder

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment
  • Wire Bonder

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MPP Manual Wire Bonder iBond 5000 Series

MPP Manual Wire Bonder iBond 5000 Series

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Wire Bonder

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Wire Bonder - Fully Automatic Wire Bond

Wire Bonder - Fully Automatic Wire Bond

Achieve high productivity with UPH25000!

Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.

  • Other processing machines
  • Wire Bonder

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Battery bonding dedicated wire bonder "Asterion-EV"

Battery bonding dedicated wire bonder "Asterion-EV"

Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

The "Asterion-EV" is a hybrid wedge bonder equipped with an expanded bonding area, intelligent pattern recognition capabilities, and rigorous process control. Based on a redesigned architecture, it combines these features to enhance productivity, bonding quality, and reliability. Additionally, it is equipped with a built-in wire feed system that operates in sync with the bond head, allowing for continuous operation at room temperature without applying heat. 【Features】 ■ The expanded bonding area improves flexibility ■ Contributes to reduced line integration costs ■ Achieves high productivity ■ Simplifies programming and optimization of bonding processes for complex devices *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment
  • Wire Bonder

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Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

  • Bonding Equipment
  • Wire Bonder

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Rotary Head Bonder REBO-9T

Rotary Head Bonder REBO-9T

Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.

- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.

  • Other semiconductors
  • Wire Bonder

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Manual and Automatic Bonding Device 'BJ653'

Manual and Automatic Bonding Device 'BJ653'

Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
  • Wire Bonder

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MPP Corporation's "Manual Wire Bonder iBond5000 Series"

MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other processing machines
  • Bonding Equipment
  • Wire Bonder

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7600D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7600D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel
  • Wire Bonder

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Semiconductor assembly device Wire bonder FB-880

Semiconductor assembly device Wire bonder FB-880

Realizing joining technology for new fields

Operator-friendly, stable, full-auto wire bonder.

  • Other semiconductor manufacturing equipment
  • Wire Bonder

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Semiconductor assembly equipment Wire Bonder FB-780

Semiconductor assembly equipment Wire Bonder FB-780

Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.

Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.

  • Other semiconductor manufacturing equipment
  • Wire Bonder

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