We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Wire Bonder.
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Wire Bonder Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Wire Bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. カイジョー ODM事業部 Tokyo//Industrial Electrical Equipment
  3. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  4. 4 超音波工業 Tokyo//Industrial Electrical Equipment
  5. 5 ハイソル Tokyo//Electronic Components and Semiconductors
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Wire Bonder Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Latest wire bonder with wire monitoring function
  2. Semiconductor assembly equipment Wire Bonder FB-900 カイジョー ODM事業部
  3. Ultrasonic Wire Bonder REBO-9 超音波工業
  4. 75um wire diameter compatible high-speed wire bonder for discrete applications
  5. 4 MPP Corporation's "Manual Wire Bonder iBond5000 Series" 兼松ＰＷＳ

Wire Bonder Product List

1～15 item / All 21 items

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7400D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a significant track record of deliveries to government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel

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Semiconductor assembly equipment Wire Bonder FB-900

Semiconductor assembly equipment Wire Bonder FB-900

Further evolved, speed and stability.

This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.

  • Other semiconductor manufacturing equipment

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Tabletop Wire Bonder "Full Manual HB05"

Tabletop Wire Bonder "Full Manual HB05"

Profiles can store up to 20 programs! Suitable for simple wiring tasks.

The "Full Manual HB05" is a full manual type tabletop wedge-ball combined wire bonder that prioritizes cost above all else. It features a liquid crystal display, with the bond profile shown digitally, and can store up to 20 programs in memory. Additionally, the wire feed function and movable clamp make wire handling tasks easy. 【Features】 ■ Focused on price with minimal functions ■ Suitable for simple wiring tasks ■ Ideal for prototype development with both wedge bond and ball bond capabilities ■ Excellent cost performance ■ Easy operation with liquid crystal display and wire feed function *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Tabletop wire bonder "Thick wire semi-auto HB30"

Tabletop wire bonder "Thick wire semi-auto HB30"

This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.

The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Ultrasonic Wire Bonder REBO-9

Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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MPP Manual Wire Bonder iBond 5000 Series

MPP Manual Wire Bonder iBond 5000 Series

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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Wire Bonder - Fully Automatic Wire Bond

Wire Bonder - Fully Automatic Wire Bond

Achieve high productivity with UPH25000!

Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.

  • Other processing machines

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Battery bonding dedicated wire bonder "Asterion-EV"

Battery bonding dedicated wire bonder "Asterion-EV"

Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

The "Asterion-EV" is a hybrid wedge bonder equipped with an expanded bonding area, intelligent pattern recognition capabilities, and rigorous process control. Based on a redesigned architecture, it combines these features to enhance productivity, bonding quality, and reliability. Additionally, it is equipped with a built-in wire feed system that operates in sync with the bond head, allowing for continuous operation at room temperature without applying heat. 【Features】 ■ The expanded bonding area improves flexibility ■ Contributes to reduced line integration costs ■ Achieves high productivity ■ Simplifies programming and optimization of bonding processes for complex devices *For more details, please download the PDF or feel free to contact us.

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  • Bonding Equipment

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Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

  • Bonding Equipment

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Tabletop Wire Bonder "Manual HB10"

Tabletop Wire Bonder "Manual HB10"

Ideal for prototype development! Recommended for simple applications such as test wiring and small-scale bonding.

The "Manual HB10" is a manual-type tabletop wedge-ball hybrid wire bonder that retains the excellent features of the "HB16" while considering price aspects. The Z-axis is motor-controlled, allowing for consistent control of loop height. The user interface features a 6.5-inch touch panel, enabling smooth changes and saving/loading of parameters. Additionally, the work surface is equipped with a sliding clamp and wire feed function, significantly reducing wire handling tasks and providing excellent operability. 【Features】 ■ Suitable for prototype development with both wedge bond and ball bond capabilities ■ Z-axis control for loop height management ■ Excellent operability with touch panel and wire feed function ■ Comprehensive features and stable bonding ■ Significant reduction in wire handling tasks *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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